Wafer-Level Integrated Systems Implementation Issues

Cover of Wafer-Level Integrated Systems Implementation Issues by Stuart K. Tewksbury
Publisher: Springer US
Year: 2012
Language: en
Edition: Softcover reprint of the original 1st ed. 1989
Pages: 456
ISBN-13: 9781461288985
Dimensions:
Height: 9.25 Inches
Length: 6.1 Inches
Weight: 1.59614677688 Pounds
Width: 1.08 Inches
Dewey Decimal: 621.3815, 621.381/73
Editorial overview Touché

Wafer-Level Integrated Systems Implementation Issues by Stuart K. Tewksbury, published by Springer US on February 9, 2012, is a softcover reprint of the original 1st edition from 1989, comprising 456 pages. This book explores the evolution of integrated circuits (ICs) into integrated systems, emphasizing the significance of wafer-scale integration in addressing complex system implementation challenges. It discusses how advancements in silicon monolithic circuits necessitate a shift in perspective from viewing ICs as discrete devices to understanding them as components of larger integrated systems.

Readers will find a detailed examination of system-level issues that impact the implementation of complex monolithic systems and components. The text highlights the importance of defect avoidance, fault tolerance, and testing in the context of very-large-scale integration (VLSI) circuits. Tewksbury argues that the concept of “wafer-level” is more fitting than “wafer-scale,” as it encompasses a range of dimensions for monolithic system components. This book serves as a comprehensive resource for those interested in technology and engineering, particularly in the fields of electronics and circuits.


Official synopsis Publisher

From the perspective of complex systems, conventional Ie’s can be regarded as “discrete” devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie’s) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit’s area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term “wafer level” is perhaps more appropriate than “wafer-scale”. A “wafer-level” monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, “wafer-scale” merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.

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This page includes the available description and bibliographic details for “Wafer-Level Integrated Systems Implementation Issues” by Stuart K. Tewksbury. Synopsis preview: From the perspective of complex systems, conventional Ie’s can be regarded as “discrete” devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system imp…
Who is the author of “Wafer-Level Integrated Systems Implementation Issues”?
“Wafer-Level Integrated Systems Implementation Issues” is credited to Stuart K. Tewksbury.
When was “Wafer-Level Integrated Systems Implementation Issues” published?
Publisher: Springer US. Year: 2012.
What is the ISBN for “Wafer-Level Integrated Systems Implementation Issues”?
ISBN-13: 9781461288985.
What are the book details (language, pages, edition)?
Language: en. Pages: 456. Edition: Softcover reprint of the original 1st ed. 1989.

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