Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration IC Stacking Process and Design by Antonis Papanikolaou, published by Springer US in December 2010, offers a comprehensive overview of three-dimensional integrated circuit (IC) stacking technology. This edition, consisting of 246 pages, presents the advancements in electronic system integration that allow for increased functionality and the integration of diverse materials and devices within a compact space. The book serves as an accessible tutorial for those unfamiliar with the complexities of 3D system integration.
Readers will find a detailed exploration of the manufacturing and design processes necessary for implementing 3D IC stacking. The content addresses various aspects of architecture, methods, and materials relevant to technology and engineering, particularly in the fields of electronics and circuit design. This resource is aimed at providing a foundational understanding of the 3D manufacturing and design chain, making it suitable for anyone interested in the future of consumer electronics and the evolving landscape of electronic systems.
Official synopsis Publisher
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
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