Thin-Film Capacitors for Packaged Electronics

Thin-Film Capacitors for Packaged Electronics by Jain Pushkar is a comprehensive resource published by Springer US on February 23, 2014. This softcover reprint of the original 1st edition from 2004 spans 158 pages and is presented in English. The book addresses the evolving requirements for capacitors in the context of increasing integration levels in electronics, covering a variety of relevant topics.
Readers will find detailed discussions on materials properties, capacitor performance limits, and process modeling, along with practical application examples. The text includes novel insights into the relationships between dielectric constants and breakdown fields, as well as electrical characterization techniques across a frequency range from 1 kHz to 20 GHz. Additionally, it explores critical issues such as preventing metal diffusion into dielectrics and measuring dielectric micro-roughness, making it a valuable reference for those interested in technology and engineering within the field of electronics.
Official synopsis Publisher
Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what’s the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.
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