Rapid Thermal Processing of Semiconductors
“Rapid Thermal Processing of Semiconductors” by Victor E. Borisenko is a comprehensive exploration of advancements in integrated circuit manufacturing, published by Springer US on June 20, 2013. This softcover reprint of the original 1st edition from 1997 spans 358 pages and is presented in English. The book delves into the contributions of rapid thermal processing to the development of single wafer cluster processing tools and other innovations, providing a thorough review of both theoretical and experimental progress in the field.
Readers will find an in-depth discussion of a wide range of materials, processes, and conditions relevant to rapid thermal processing. The authors, Borisenko and Hesketh, compile insights from international investigators, making this work a valuable resource for those interested in technology and engineering, particularly in the areas of materials science and electronic materials. The book serves as a detailed reference for understanding the complexities of rapid thermal processing and its implications in the semiconductor industry.
Official synopsis Publisher
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
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